Manufacturing method of array substrate, array substrate and liquid crystal display panel

ABSTRACT

A manufacturing method of an array substrate is provided, including steps: forming a light shield layer and a first metal layer on a transparent base to locate the light shield layer between the transparent base and the first metal layer and identify a pattern of the light shield layer and a pattern of the first metal layer, forming an insulating layer, a passageway layer and an ohmic contact layer sequentially on the first metal layer, forming a second metal layer on the ohmic contact layer, forming a passivation layer on the second metal layer and forming a contact hole in the passivation layer, and forming a pixel electrode layer on the passivation layer to allow the pixel electrode layer to connect the second metal layer through the contact hole. Moreover, an array substrate and a liquid crystal display panel are further provided.

FIELD OF THE DISCLOSURE

The disclosure relates to a display technical field, and moreparticularly to a manufacturing method of an array substrate, an arraysubstrate and a liquid crystal display panel.

BACKGROUND

An exemplary liquid crystal display includes an array substrate and acolor filter substrate. In the manufacturing process, the arraysubstrate includes five processes of M1/AS/M2/PV/ITO with five masks,and the color filter substrate includes five processes of BM/R/G/B/PSwith five masks. The function of the black matrix of the color filtersubstrate is to block light leaked due to the liquid crystal directionchaos caused by disordered electric field adjacent to data lines andgate lines.

But in practical manufacturing process, especially when the liquidcrystal display panel are aligned, the black matrix and the data linecan easily dislocated, resulting in light leakage on the side of thedata line to severely affect the qualified rate of products. In theexemplary technology, the width of the black matrix on the color filtersubstrate can be raised to reduce the possibility of leaking light,resulting in an effect of preventing light leakage to some extent butthe transmittance is significantly degraded.

SUMMARY

An embodiment of the disclosure provides a manufacturing method of anarray substrate, an array substrate and a liquid crystal display panelfor enhancing the display effect of the liquid crystal display deviceand the qualified rate of products.

The disclosure provides a manufacturing method of an array substrate,including steps: forming a light shield layer and a first metal layer ona transparent base to locate the light shield layer between thetransparent base and the first metal layer and identify a pattern of thelight shield layer and a pattern of the first metal layer, forming aninsulating layer, a passageway layer and an ohmic contact layersequentially on the first metal layer, forming a second metal layer onthe ohmic contact layer, forming a passivation layer on the second metallayer and forming a contact hole in the passivation layer; and forming apixel electrode layer on the passivation layer to allow the pixelelectrode layer to connect the second metal layer through the contacthole.

In an embodiment of the disclosure, forming the light shield layer andthe first metal layer on the transparent base to locate the light shieldlayer between the transparent base and the first metal layer andidentify the pattern of the light shield layer and the pattern of thefirst metal layer includes: forming a black shield material layer on thetransparent base, forming a first metal material layer on the blackshield material layer, forming a photoresist material layer on the firstmetal material layer, exposing and developing the photoresist materiallayer by a mask to obtain a patterned photoresist material layer,processing the first metal material layer and the black shield materiallayer sequentially by a wet etching and a dry etching with the patternedphotoresist material layer as the mask, and removing a residualphotoresist material layer after the dry etching to obtain the lightshield layer and the first metal layer.

In an embodiment of the disclosure, a material of the light shield layeris a black photoresist containing carbon black.

In an embodiment of the disclosure, the light shield layer and the firstmetal layer are formed in an identical mask process.

In an embodiment of the disclosure, the first metal layer includes ascan line, a common electrode and a gate electrode of a thin filmtransistor.

In an embodiment of the disclosure, the ohmic contact layer includes afirst region and a second region separated from each other on thepassageway layer.

In an embodiment of the disclosure, the second metal layer includes asource electrode of a thin film transistor, a drain electrode of thethin film transistor and a data line; the data line is connected to thesource electrode; the drain electrode is connected to the pixelelectrode layer through the contact hole; the source electrode isconnected to the first region of the ohmic contact layer, and the drainelectrode is connected to the second region of the ohmic contact layer.

In an embodiment of the disclosure, the transparent base is made out ofglass, quartz or organic polymer.

An embodiment of the disclosure further provides an array substrate,including: a transparent base, a light shield layer disposed on thetransparent base, a first metal layer disposed on the light shieldlayer, an insulating layer disposed on the first metal layer, apassageway layer disposed on the insulating layer, an ohmic contactlayer disposed on the passageway layer, a second metal layer disposed onthe ohmic contact layer, a passivation layer disposed on the secondmetal layer and formed with a contact hole, and a pixel electrode layerdisposed on the passivation layer and connected to the second metallayer through contact hole. The light shield layer is located betweenthe transparent base and the first metal layer, and a pattern of thelight shield layer and a pattern of the first metal layer are identical.

In an embodiment of the disclosure, a material of the light shield layeris a black photoresist containing carbon black.

In an embodiment of the disclosure, the first metal layer includes ascan line, a common electrode and a gate electrode of a thin filmtransistor.

In an embodiment of the disclosure, the second metal layer includes asource electrode of a thin film transistor, a drain electrode of thethin film transistor and a data line. The data line is connected to thesource electrode, and the drain electrode is connected to the pixelelectrode layer through the contact hole.

In an embodiment of the disclosure, the first metal layer and the lightshield layer are immediately contacted.

An embodiment of the disclosure further provides a liquid crystaldisplay panel, including: an array substrate, a color filter substratedisposed opposite to the array substrate and a liquid crystal layerdisposed between the array substrate and the color filter substrate. Thecolor filter substrate includes a black matrix layer.

The array substrate includes: a transparent base, a light shield layerdisposed on the transparent base, a first metal layer disposed on thelight shield layer, an insulating layer disposed on the first metallayer, a passageway layer disposed on the insulating layer, an ohmiccontact layer disposed on the passageway layer, a second metal layerdisposed on the ohmic contact layer, a passivation layer disposed on thesecond metal layer and formed with a contact hole, a pixel electrodelayer disposed on the passivation layer and connected to the secondmetal layer through contact hole, a color filter substrate disposedopposite to the array substrate, and a liquid crystal layer, disposedbetween the array substrate and the color filter substrate. The lightshield layer is located between the transparent base and the first metallayer, and a pattern of the light shield layer and a pattern of thefirst metal layer are identical.

In an embodiment of the disclosure, a material of the light shield layeris a black photoresist containing carbon black.

In an embodiment of the disclosure, the first metal layer includes ascan line, a common electrode and a gate electrode of a thin filmtransistor.

In an embodiment of the disclosure, the second metal layer includes asource electrode of a thin film transistor, a drain electrode of thethin film transistor and a data line. The data line is connected to thesource electrode, and the drain electrode is connected to the pixelelectrode layer through the contact hole.

In an embodiment of the disclosure, the first metal layer and the lightshield layer are immediately contacted.

In an embodiment of the disclosure, a material of the light shield layeron the array substrate and a material of the black matrix layer on thecolor filter substrate are identical.

In an embodiment of the disclosure, the transparent base can be made outof glass, quartz or organic polymer.

Disposing the light shield layer between the transparent base and thefirst metal layer on the array substrate in the disclosure overcomes thelight leaked on the side of the data lines and the common electrodecaused by the alignment dislocation problem when the array substrate andthe color filter substrate are aligned to improve the display effect ofthe liquid crystal display panel and the qualified rate of liquidcrystal display panels.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate technical solutions in embodimentsof the disclosure, the drawings required in description of theembodiments will be briefly introduced. Apparently, the describeddrawings below are just some embodiments of the disclosure, and a personskilled in the art can obtain other drawings according to these drawingswithout any inventive work.

FIGS. 1a-1j are cross-sectional views of a manufacturing process of anarray substrate according to an embodiment of the disclosure.

FIG. 2 is a structural schematic view of an array substrate according toanother embodiment of the disclosure;

FIG. 3 is a cross-sectional schematic view of the array substrate takenalong a line A in FIG. 1.

FIG. 4 is a cross-sectional schematic view of the array substrate takenalong a line B in FIG. 1;

FIG. 5 is a structural schematic view of a liquid crystal display panelaccording to still another embodiment of the disclosure.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Technical solutions in embodiments of the disclosure will be describedclearly with reference to the accompanying drawings in the embodimentsof the disclosure as follows. Apparently, the described embodiments aremerely some embodiments of the disclosure rather than all of theembodiments. Based on the embodiments in the disclosure, all the otherembodiments obtained by a person skilled in the art without anycreativity should belong to the protective scope of the disclosure.

As shown from FIG. 1a to FIG. 1j , an embodiment of the disclosureprovides a manufacturing method of an array substrate 100, specificallyincluding:

(a) as shown in FIGS. 1a-1f , forming a light shield layer SL and afirst metal layer M1 on a transparent base 110 to locate the lightshield layer SL between the transparent base 110 and the first metallayer M1. Optionally, the light shield layer SL and the first metallayer M1 are immediately contacted. The light shield layer SL and thefirst metal layer M1 are formed in one mask M to identify a pattern ofthe light shield layer SL and a pattern of the first metal layer M1,specifically including:

(a1) forming a black shield material layer SL′ on the transparent base110, then forming a first metal material layer M1′ on the black shieldmaterial layer SL′, subsequently forming a photoresist layer PR on thefirst metal material layer M1′, as shown in FIG. 1 a.

(a2) As shown in FIG. 1b , the photoresist layer PR is exposed anddeveloped by using the mask M to obtain the patterned photoresist layerPR. The mask M is engraved with a certain pattern. The photoresist layerPR is exposed by using ultraviolet UV penetrating the mask M, and thepattern in the mask M is trans-printed onto the photoresist layer PR.The photoresist layer PR is sprayed by the developer, and thephotoresist material exposed under the UV is dissolved in the developerto obtain the patterned photoresist layer PR, as shown in FIG. 1 c.

(a3) The first metal material layer M1′ and the black shield materiallayer SL′ are sequentially processed by wet etching and dry etching withthe patterned photoresist layer PR as the mask, as shown in FIG. 1d andFIG. 1 e.

(a4) The residual photoresist layer PR is removed after dry etching toobtain the light shield layer SL and the first metal layer M1, as shownin FIG. 1 f.

(b) An insulating layer GSN, a passageway layer AS and an ohmic contactlayer NS. The ohmic contact layer NS includes a first region NS1 and asecond region NS2, as shown in FIG. 1 g.

(h) As shown in FIG. 1h , the ohmic contact layer NS is formed with asecond metal layer M2. The second metal layer M2 includes a sourceelectrode S of the thin film transistor, a drain electrode D of the thinfilm transistor and a data line 150 (not shown in FIG. 1h ). The dataline 150 is connected to the source electrode S; the source electrode Sis connected to the first region NS1 of the first ohmic contact layerNS; the drain electrode D is connected to the second region NS2 of theohmic contact layer NS.

(i) The second metal layer M2 is formed with a passivation layer PSN andthe passivation layer PSN is formed with a contact hole CH, as shown inFIG. 1 i.

(j) As shown in FIG. 1j , the passivation layer PSN is formed with apixel electrode layer PE. The pixel electrode layer PE is connected tothe drain electrode D of the thin film transistor through the contacthole CH of the passivation layer PSN. And the array substrate isprepared.

Overall, the light shield layer is added before the first metal layer ofthe array substrate in the embodiment, and one photoresist layer withthe same pattern is utilized as the mask to sequentially process thefirst metal layer by wet etching and dry etching to achieve the lightshield layer and the first metal layer to share the mask and simplifythe manufacturing process, as well as reducing the manufacturing cost.

As shown in FIG. 2, FIG. 3 and FIG. 4, another embodiment of thedisclosure provides an array substrate 100, including the transparentbase 110, the light shield layer SL, the first metal layer M1, theinsulating layer GSN, the passageway layer AS, the ohmic contact layerNS, the second metal layer M2, the passivation layer PSN and the pixelelectrode layer PE. The light shield layer SL is disposed on thetransparent base 110, and sequentially disposed with the first metallayer M1, the insulating layer GSN, the passageway layer AS, the ohmiccontact layer NS, the second metal layer M2, and the passivation layerPSN. The passivation layer PSN is formed with the contact hole CH. Thepixel electrode layer PE is disposed on the passivation layer PSN andconnected to the second metal layer M2 through the contact hole CH.

Specifically, the transparent base 110 can be made out of glass, quartz,organic polymer or other adaptable materials. The material of the lightshield layer SL can be an opaque material such as the black photoresistcontaining carbon black with the function of blocking light. Optionally,the pattern of the light shield layer SL and the pattern of the firstmetal layer M1 are identical, namely shapes and sizes of the lightshield layer SL and first metal layer M1 are completely the same.

The first metal layer M1 can be a conductive layer, and the material canbe molybdenum, aluminum, copper, titanium, wolfram and the like. Thefirst metal layer M1 includes a scan line 131 and a common electrode133. The second metal layer M2 includes the data line 150. The scan line131 and the data line 150 primarily are configured to transfer andmotivate driving signals of all pixels 170 on the array substrate 100.The extension direction of the scan line 131 and the extension directionof the data line 150 are different; the extension direction of the scanline 131 is optionally perpendicular to the extension direction of thedata line 150, namely the scan line 131 and the data line 150 arearranged to be mutually vertical and crisscross. Scan lines 131 and datalines 150 are crisscross to form staggered regions distributed as anarray, and one of the staggered regions is named as a pixel 170 for thepurpose of illustration herein.

As shown in FIG. 3, each of the pixels 170 is disposed with a thin filmtransistor 171 and a pixel electrode 173. The thin film transistor 171includes the gate electrode G, the insulating layer GSN, the passagewaylayer AS, the ohmic contact layer NS, the source electrode S, the drainelectrode D and the passivation layer PSN.

Specifically, the first metal layer M1 further includes the gateelectrode G of the thin film transistor 171. The gate electrode G isconnected to the scan lines 131. The insulating layer GSN is locatedon/above the gate electrode G; the passageway layer AS is locatedon/above the insulating layer GSN and corresponding to the gateelectrode G. The ohmic contact layer NS includes the first region NS1and the second region NS2 mutually separated on the passageway layer AS.The second metal layer M2 further includes the source electrode S of thethin film transistor 171 and the drain electrode D of the thin filmtransistor 171. The source electrode S and the drain electrode D arelocated above the passageway layer AS, and the source electrode S isconnected to the data line 150. The source electrode S is connected tothe first region NS1 of the ohmic contact layer NS; the drain electrodeD is connected to the second region NS2 of the ohmic contact layer. Thepassivation layer PSN covers the source electrode S, the drain electrodeD and the data line 150, and the contact hole is formed correspondinglyto the drain electrode D for connecting the drain electrode D and thepixel electrode 173. The material of the pixel electrode 173 can be atransparent oxide material such as indium tin oxide (ITO).

As shown in FIG. 4, the common electrode 133 is disposed on the lightshield layer SL and shown as a U shape, and three sides are surroundedby the pixel electrode 173 but without any contact therebetween due tothe insulating layer GSN and the passivation layer PSN as theseparation. The projection of the common electrode 133 on thetransparent base 110 is partially overlapped with the projection of thepixel electrode 173 on the transparent base 110 to form the storagecapacitance between the common electrode 133 and the pixel electrode173.

In summary, the light shield layer between the transparent base and thefirst metal layer on the array substrate of the embodiment is configuredto overcome the light leakage problem caused by dislocation of the blackmatrix on the color filter substrate and the data lines on the arraysubstrate in the cell process of the array substrate and the colorfilter substrate, resulting in improving the display effect of liquidcrystal display devices and the qualified rate of liquid crystal displaydevices.

As shown in FIG. 5, another embodiment of the disclosure provides aliquid crystal display panel 10, including: the array substrate 100, acolor filter substrate 300, and a liquid crystal layer 500. The arraysubstrate 100 and the color filter substrate 300 are disposed opposite.The liquid crystal layer 500 is disposed between the array substrate 100and the color filter substrate 300.

The array substrate 100 is the array substrate described in theembodiments above, configured to transmit and control electric signals.

The color filter substrate 300 is configured to display colors. Thecolor filter substrate 300 includes a black matrix 310. The material ofthe black matrix 310 can be a material such as the black photoresistcontaining carbon black, configured to absorb and block light.Optionally, the material of the black matrix 310 and the material of thelight shield layer SL in the array substrate 100 are the same, and inthe manufacturing process, extra materials are unnecessary, resulting inreducing the manufacturing cost of liquid crystal display devices.

The fulfillment and technical effects of the display device 10 can bereferred to the manufacturing method of an array substrate in theembodiments above, without further repeat herein.

In the embodiments provided by the disclosure, comprehensively, thedisclosed system, device and method can be fulfilled in other manners.For instance, the device in the embodiments above purely is exemplary,for instance, the component division merely is a logic functionaldivision, and other divisions can be provided in practice, such as thecomponents or elements can be combined or integrated in another system,or some features can be skipped, or unexecuted. Additionally, thedisplayed or discussed mutual coupling or direct coupling, orcommunication connection can be indirect coupling or communicationconnection by some ports, devices or elements, electrically,mechanically or in other forms.

The individually illustrated components can be separated in physical ornot, and the components as unit display can be a physical component ornot, namely located on one position, or distributed on networks. Theobjective of the embodiments can be fulfilled by selecting some or allof the components according to the practical requirement.

The final declaration is the embodiments above purely are forillustrating the technical solutions of the disclosure rather than anylimitation; even though the disclosure has been illustrated in detailwith reference to the aforementioned embodiments, a person skilled inthe art can understand the technical solutions recorded in theembodiments above can be modified, or some of the features can bereplaced; but the modification or replacement will not lead to theessence of the corresponding technical solution to be excluded from thespirit and scope of the technical solutions of the embodiments of thedisclosure.

What is claimed is:
 1. A manufacturing method of an array substrate,comprising: forming a light shield layer and a first metal layer on atransparent base to locate the light shield layer between thetransparent base and the first metal layer and identify a pattern of thelight shield layer and a pattern of the first metal layer; forming aninsulating layer, a passageway layer and an ohmic contact layersequentially on the first metal layer; forming a second metal layer onthe ohmic contact layer; forming a passivation layer on the second metallayer and forming a contact hole in the passivation layer; and forming apixel electrode layer on the passivation layer to allow the pixelelectrode layer to connect the second metal layer through the contacthole.
 2. The manufacturing method of an array substrate according toclaim 1, wherein forming the light shield layer and the first metallayer on the transparent base to locate the light shield layer betweenthe transparent base and the first metal layer and identify the patternof the light shield layer and the pattern of the first metal layercomprises: forming a black shield material layer on the transparentbase; forming a first metal material layer on the black shield materiallayer; forming a photoresist layer on the first metal material layer;exposing and developing the photoresist layer by a mask to obtain apatterned photoresist layer; processing the first metal material layerand the black shield material layer sequentially by a wet etching and adry etching with the patterned photoresist layer as the mask; andremoving a residual photoresist layer after the dry etching to obtainthe light shield layer and the first metal layer.
 3. The manufacturingmethod of an array substrate according to claim 1, wherein a material ofthe light shield layer is a black photoresist containing carbon black.4. The manufacturing method of an array substrate according to claim 1,wherein the light shield layer and the first metal layer are formed inan identical mask process.
 5. The manufacturing method of an arraysubstrate according to claim 1, wherein the first metal layer comprisesa scan line, a common electrode and a gate electrode of a thin filmtransistor.
 6. The manufacturing method of an array substrate accordingto claim 1, wherein the ohmic contact layer comprises a first region anda second region separated from each other on the passageway layer. 7.The manufacturing method of an array substrate according to claim 6,wherein the second metal layer comprises a source electrode of a thinfilm transistor, a drain electrode of the thin film transistor and adata line, the data line is connected to the source electrode, the drainelectrode is connected to the pixel electrode layer through the contacthole, the source electrode is connected to the first region of the ohmiccontact layer, and the drain electrode is connected to the second regionof the ohmic contact layer.
 8. The manufacturing method of an arraysubstrate according to claim 1, wherein the transparent base is made outof glass, quartz or organic polymer.
 9. An array substrate comprising: atransparent base; a light shield layer, disposed on the transparentbase; a first metal layer, disposed on the light shield layer; whereinthe light shield layer is located between the transparent base and thefirst metal layer and a pattern of the light shield layer and a patternof the first metal layer are identical; an insulating layer, disposed onthe first metal layer; a passageway layer, disposed on the insulatinglayer; an ohmic contact layer, disposed on the passageway layer; asecond metal layer, disposed on the ohmic contact layer; a passivationlayer, disposed on the second metal layer and formed with a contacthole; and a pixel electrode layer, disposed on the passivation layer andconnected to the second metal layer through the contact hole.
 10. Thearray substrate according to claim 9, wherein a material of the lightshield layer is a black photoresist containing carbon black.
 11. Thearray substrate according to claim 9, wherein the first metal layercomprises a scan line, a common electrode and a gate electrode of a thinfilm transistor.
 12. The array substrate according to claim 9, whereinthe second metal layer comprises a source electrode of a thin filmtransistor, a drain electrode of the thin film transistor and a dataline, the data line is connected to the source electrode, and the drainelectrode is connected to the pixel electrode layer through the contacthole.
 13. The array substrate according to claim 9, wherein the firstmetal layer and the light shield layer are immediately contacted.
 14. Aliquid crystal display panel comprising: an array substrate, comprising:a transparent base; a light shield layer, disposed on the transparentbase; a first metal layer, disposed on the light shield layer; whereinthe light shield layer is located between the transparent base and thefirst metal layer and a pattern of the light shield layer and a patternof the first metal layer are identical; an insulating layer, disposed onthe first metal layer; a passageway layer, disposed on the insulatinglayer; an ohmic contact layer, disposed on the passageway layer; asecond metal layer, disposed on the ohmic contact layer; a passivationlayer, disposed on the second metal layer and formed with a contacthole; a pixel electrode layer, disposed on the passivation layer andconnected to the second metal layer through the contact hole; a colorfilter substrate, disposed opposite to the array substrate, wherein thecolor filter substrate comprises a black matrix layer; and a liquidcrystal layer, disposed between the array substrate and the color filtersubstrate.
 15. The liquid crystal display panel according to claim 14,wherein a material of the light shield layer is a black photoresistcontaining carbon black.
 16. The liquid crystal display panel accordingto claim 14, wherein the first metal layer comprises a scan line, acommon electrode and a gate electrode of a thin film transistor.
 17. Theliquid crystal display panel according to claim 14, wherein the secondmetal layer comprises a source electrode of a thin film transistor, adrain electrode of the thin film transistor and a data line, the dataline is connected to the source electrode, and the drain electrode isconnected to the pixel electrode layer through the contact hole.
 18. Theliquid crystal display panel according to claim 14, wherein the firstmetal layer and the light shield layer are immediately contacted. 19.The liquid crystal display panel according to claim 14, wherein amaterial of the light shield layer on the array substrate and a materialof the black matrix layer on the color filter substrate are identical.20. The liquid crystal display panel according to claim 14, wherein thetransparent base is made out of glass, quartz or organic polymer.